Chip package substrate having soft circuit board and method for fabricating the same

ABSTRACT

A chip package substrate having a soft circuit board jas a multi-layer soft and hard composite PCB, a plurality of conducting components and a plurality of conducting holes. The conducting holes are formed in the multi-layer soft and hard composite PCB. The conducting components are electroplated on the inner edges of the conducting holes on the multi-layer soft and hard composite PCB. An image-sensing chip can thus be packaged on the chip package substrate with the soft circuit board used as external signal connection lines, thereby saving the manufacturing cost and increasing the yield thereof.

FIELD OF THE INVENTION

The present invention relates to a chip package substrate having a softcircuit board and a method for manufacturing the same and, moreparticularly, to a chip package substrate with a soft circuit boardformed on a soft and hard composite circuit board to be used as externalsignal connection lines.

BACKGROUND OF THE INVENTION

A common chip needs to be packaged and then electrically connected withan electronic board to be installed in an electronic device. Inparticular, an image-sensing chip needs to be protected by a packagebody and then electrically connected with an electronic board foroperation.

FIGS. 1A to 1G show the method for electrically connecting animage-sensing chip like a CCD or a CMOS sensor with an electronic board.First, a ceramic package substrate 10 a is prepared. A groove 11 a isformed in the upper side of the ceramic package substrate 10 a. Animage-sensing chip 20 a is then adhered in the groove 11 a of theceramic package substrate 10 a. Electric connection lines 30 a are thenused to electrically connect the ceramic package substrate 10 a and theimage-sensing chip 20 a. Next, a transparent board 40 a is attached onthe upper side of the ceramic package substrate 10 a to package theimage-sensing chip 20 a. A package body 50 a having the image-sensingchip 20 a is then adhered to an electronic board 60 a by means ofsurface mount technology (SMT). Finally, a lens seat 70 a and a lens 80a are then assembled on the package body 50 a to finish an imagedetection module.

FIGS. 2A to 2F show another method for assembling an image-sensing chipinto an image detection module. First, a hard PCB 90 a is manufacturedwith a plurality of solder pads 91 a thereon. The image-sensing chip 20a is adhered on the upper side of the hard PCB 90 a. The electricconnection lines 30 a are then used to electrically connect theimage-sensing chip 20 a and the solder pads 91 a. The lens seat 70 a andthe lens 80 a are then assembled on the hard PCB 90 a to package theimage-sensing chip 20 a on the hard PCB 90 a. The lower end face of thehard PCB 90 a has a plurality of electric connection sheets 92 a. A softcircuit board 100 a having comb-shaped electric connection sheets 101 aat two ends thereof is also prepared. The comb-shaped electricconnection sheet 101 a at one end of the soft circuit board 100 a isstained with conducting glue to be pressed and adhered to the electricconnection sheet 92 a at the lower end face of the hard PCB 90 a. Thecomb-shaped electric connection sheet 101 a at the other end of the softcircuit board 100 a is also stained with conducting glue to be pressedand adhered to the electronic board 60 a or via a connector 93 a,thereby forming an image detection module.

However, the above methods for assembling an image-sensing chip into animage detection module have the following drawbacks:

-   -   1. Because the price of the ceramic package substrate is high,        the material cost is thus increased. Moreover, because it is        necessary to connect the package body having the image-sensing        chip firmly on the electronic board, the installation        flexibility of the package body is thus reduced.    -   2. Because the comb-shaped electric connection sheet and the        electric connection sheet of the hard PCB are glued together        with conducting glue on a small area, the adhesion strength is        low.    -   3. When the hard PCB and the soft circuit board having        comb-shaped electric connection sheets are glued together, the        comb-shaped electric connection sheet may be not completely        pressed on the hard PCB due to unevenness of the end face of the        hard PCB having the electric connection sheet, hence reducing        the adhesion strength. Moreover, it is necessary to use a        microscope to view and align the adhesion portion of the two        components, hence increasing the manufacturing time and wasting        manpower. Also, the conductivity of the conducting glue is        reduced after a period of time at room temperature, hence        lowering the yield.

SUMMARY OF THE INVENTION

One object of the present invention is to provide a chip packagesubstrate having a soft circuit board and a method for manufacturing thesame, in which a package PCB and soft electric connection lines of animage-sensing chip are simultaneously finished for a singlemanufacturing process to simplify the electric connection process afterchip packaging, reduce manual operations, and increase the yieldthereof.

Another object of the present invention is to provide a chip packagesubstrate having a soft circuit board, in which the size of thesubstrate and the soft electric connection lines are reduced to lowerthe cost.

Yet another object of the present invention is to provide a chip packagesubstrate having a soft circuit board, in which soft electric connectionlines are adhered on the chip package substrate with a larger area toenhance the adhesion strength and also increase the yield thereof.

To achieve the above objects, the present invention provides a chippackage substrate having a soft circuit board. The chip packagesubstrate is used to package an image-sensing chip. The soft circuitboard is used as external signal connection lines. The chip packagesubstrate having a soft circuit board comprises a multi-layer soft andhard composite PCB, a plurality of conducting components and a pluralityof conducting holes. The conducting holes are formed on the multi-layersoft and hard composite PCB. The conducting components are electroplatedon the inner edges of the conducting holes on the multi-layer soft andhard composite PCB. An image-sensing chip can thus be packaged on thechip package substrate with the soft circuit board used as externalsignal connection lines to reduce the manufacturing cost and increasethe yield thereof.

Moreover, the present invention also provides a method for manufacturinga chip package substrate having a soft circuit board. The methodcomprises providing a multi-layer soft and hard composite PCB andremoving predetermined portions of the multi-layer soft and hardcomposite PCB to form the chip package substrate having a soft circuitboard on the multi-layer soft and hard composite PCB.

BRIEF DESCRIPTION OF THE DRAWINGS

The various objects and advantages of the present invention will be morereadily understood from the following detailed description when read inconjunction with the appended drawings, in which:

FIGS. 1A to 1G show the flowchart of a conventional method ofelectrically connecting an image-sensing chip with an electronic board;

FIGS. 2A to 2F show the flowchart of another conventional method ofelectrically connecting an image-sensing chip with an electronic board;

FIG. 3 is a perspective view of a chip package substrate having a softcircuit board of the present invention;

FIG. 4 is a cross-sectional view of a chip package substrate having asoft circuit board of the present invention;

FIG. 5 is the flowchart of a method for manufacturing a chip packagesubstrate having a soft circuit board of the present invention;

FIG. 6 is a perspective view of a chip package substrate having a softcircuit board on a multi-layer soft and hard composite PCB of thepresent invention; and

FIGS. 7A to 7D show the flowchart of a method of electrically connectingan image-sensing chip with an electronic board of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

As shown in FIG. 3, the present invention provides a soft circuit boardand a method for manufacturing the same. An image-sensing chip ispackaged on the chip package substrate. The soft circuit board is usedas external signal connection lines to connect an electronic board forforming an image detection module thereto. The method for manufacturingthe chip package substrate having a soft circuit board providesmanufacturing of the chip package substrate having a soft circuit boardbefore chip packaging, hence simplifying the adhesion process of thesoft circuit board after the chip is packaged on the chip packagesubstrate.

As shown in FIGS. 3 and 4, a chip package substrate 10 having a softcircuit board is used to package an image-sensing chip 20. The softcircuit board is used as external signal connection lines. The chippackage substrate 10 comprises a multi-layer soft and hard composite PCB30, a plurality of conducting components 50 and a plurality ofconducting holes 60. The multi-layer soft and hard composite PCB 30comprises a multi-layer hard PCB 35 and at least a soft circuit board40, which are adhered together to form the multi-layer soft and hardcomposite PCB 30. The soft circuit board 40 is extended out of themulti-layer hard PCB 35. One end of the soft circuit board 40 extendingout of the multi-layer hard PCB 35 has a comb-shaped electric connectionsheet 70. A groove 80 is formed in the upper side of the multi-layerhard PCB 35 of the multi-layer soft and hard composite PCB 30. Aplurality of solder pads 90 is distributed on the upper surface of theperiphery of the multi-layer soft and hard composite PCB 30 and connectspart of the conducting components 50 to connect electrically theimage-sensing chip 20. The conducting holes 60 are formed on themulti-layer hard PCB 35 and the soft circuit board 40. The conductingcomponents 50 are electroplated on inner edges of the conducting holes60 on the multi-layer hard PCB 35 and the soft circuit board 40 toconnect electrically the multi-layer hard PCB 35 and the soft circuitboard 40. The image-sensing chip 20 can thus be packaged in the groove80 on the multi-layer soft and hard composite PCB 30. The soft circuitboard 40 can also be used to electrically connect an electronic board toform an image detection module.

FIGS. 5 and 6 show the method for manufacturing a chip package substratehaving a soft circuit board. The method comprises the steps of:

-   -   A. providing a multi-layer soft and hard composite PCB 120,        which comprises a plurality of hard PCBs and at least a soft        circuit board;    -   B. forming a groove 80 on the multi-layer soft and hard        composite PCB 120;    -   C. removing predetermined portions of the multi-layer soft and        hard composite PCB to form the chip package substrate 10 having        a soft circuit board on the multi-layer soft and hard composite        PCB 120, hence packaging an image-sensing chip on the chip        package substrate and using the soft circuit board as external        signal connection lines; and    -   D. separating the multi-layer soft and hard composite PCB 120        and the chip package substrate 10 having a soft circuit board.

The multi-layer soft and hard composite PCB 120 can be used tosimultaneously manufacture a plurality of chip package substrates 10having a soft circuit board. The groove 80 is formed on the multi-layersoft and hard composite PCB 120. Predetermined portions of themulti-layer soft and hard composite PCB 120 are then removed by drillingor milling to form a plurality of two opposite chip package substrates10 having a soft circuit board on the multi-layer soft and hardcomposite PCB 120. The soft circuit boards 40 of the chip packagesubstrates 10 having a soft circuit board are opposed to one another andare connected together intermittently. The chip package substrates 10having a soft circuit board are connected on the multi-layer soft andhard composite PCB 120 in a partially intermittent connection tofacilitate separation of the chip package substrates 10 having a softcircuit board and the multi-layer soft and hard composite PCB 120 whenin use.

As shown in FIGS. 7A to 7D, the image-sensing chip 20 is electricallyconnected to the chip package substrate 10 having a soft circuit board.A lens seat 100 and a lens 110 are used to package the image-sensingchip 20 on the multi-layer hard PCB 35. The comb-shaped electricconnection sheet 70 at one end of the soft circuit board 40 iselectrically connected to the electronic board 90 to form an imagedetection module, which can then be applied in a video phone, a personaldigital assistant (PDA), a smart phone, a handheld device or a portablepersonal computer (PC) for picking up images and storing them in thedevice.

To sum up, the present invention provides a chip package substratehaving a soft circuit board and a method for manufacturing the same, inwhich a package PCB and soft electric connection lines of animage-sensing chip are simultaneously finished for a singlemanufacturing process to simplify the electric connection process afterchip packaging, reduce manual operations, and increase the yieldthereof. Moreover, the size of the substrate and the soft electricconnection lines are reduced to lower the cost. Further, soft electricconnection lines are adhered on the chip package substrate with a largerarea to enhance the adhesion strength and also increase the yieldthereof.

Although the present invention has been described with reference to thepreferred embodiments thereof, it will be understood that the inventionis not limited to the details thereof. Various substitutions andmodifications have been suggested in the foregoing description, andothers will occur to those of ordinary skill in the art. Therefore, allsuch substitutions and modifications are intended to be embraced withinthe scope of the invention as defined in the appended claims.

1. A chip package substrate having a soft circuit board, animage-sensing chip being packaged on said chip package substrate, saidsoft circuit board being used as external signal connection lines, saidchip package substrate comprising: a multi-layer soft and hard compositePCB comprising a multi-layer hard PCB and at least a soft circuit board,said soft circuit board being extended out of said multi-layer hard PCB;a plurality of conducting holes formed in said multi-layer hard PCB andsaid soft circuit board; and a plurality of conducting componentselectroplated on inner edges of said conducting holes on saidmulti-layer hard PCB and said soft circuit board to connect electricallysaid multi-layer hard PCB and said soft circuit board.
 2. The chippackage substrate having a soft circuit board as claimed in claim 1,wherein a groove is formed in an upper side of said multi-layer soft andhard composite PCB to carry said image-sensing chip.
 3. The chip packagesubstrate having a soft circuit board as claimed in claim 2, whereinsaid groove is formed in said multi-layer hard PCB.
 4. The chip packagesubstrate having a soft circuit board as claimed in claim 1, whereinsaid multi-layer soft and hard composite PCB has a plurality of solderpads, which are distributed on an upper surface of a periphery of saidmulti-layer soft and hard composite PCB and connect part of saidconducting components.
 5. The chip package substrate having a softcircuit board as claimed in claim 1, wherein said soft circuit board islocated below said multi-layer hard PCB.
 6. A method for manufacturing achip package substrate having a soft circuit board, the methodcomprising the steps of: providing a multi-layer soft and hard compositePCB; and removing predetermined portions of said multi-layer soft andhard composite PCB to form said chip package substrate having a softcircuit board on said multi-layer soft and hard composite PCB.
 7. Themethod for manufacturing a chip package substrate having a soft circuitboard as claimed in claim 6, wherein said multi-layer soft and hardcomposite PCB comprises a multi-layer hard PCB and at least a softcircuit board, said chip package substrate is formed on said multi-layerhard PCB after predetermined portions of said soft and hard compositePCB are removed, and said soft circuit board is extended out of saidmulti-layer hard PCB.
 8. The method for manufacturing a chip packagesubstrate having a soft circuit board as claimed in claim 6, furthercomprising the steps of: forming a groove in said multi-layer soft andhard composite PCB; and carrying said image-sensing chip in said grooveof said multi-layer soft and hard composite PCB after predeterminedportions of said soft and hard composite PCB are removed.
 9. The methodfor manufacturing a chip package substrate having a soft circuit boardas claimed in claim 8, wherein said groove is formed in said multi-layersoft and hard composite PCB by means of milling.
 10. The method formanufacturing a chip package substrate having a soft circuit board asclaimed in claim 6, wherein said multi-layer soft and hard composite PCBcomprises a plurality of hard PCBs and at least a soft circuit board,two opposite chip package substrates having a soft circuit board areformed on said multi-layer soft and hard composite PCB after thepredetermined portions of said hard PCBs and said soft circuit board areremoved, and end portions of said soft circuit boards oppose one anotherand are connected together intermittently.
 11. The method formanufacturing a chip package substrate having a soft circuit board asclaimed in claim 6, wherein said chip package substrate having a softcircuit board is formed on said multi-layer soft and hard composite PCBafter predetermined portions of said multi-layer soft and hard compositePCB are removed, and said chip package substrate having a soft circuitboard is intermittently connected with said multi-layer soft and hardcomposite PCB.
 12. The method for manufacturing a chip package substratehaving a soft circuit board as claimed in claim 6, wherein predeterminedportions of said multi-layer soft and hard composite PCB are removed bymeans of milling.
 13. The method for manufacturing a chip packagesubstrate having a soft circuit board as claimed in claim 6, whereinpredetermined portions of said multi-layer soft and hard composite PCBare removed by means of drilling.